폰을 크게 한번 떨어트린 이후로, 화면의 반이 나오지 않아요. 나오지 않는 부분이 터치 동작은 되는데... 아이픽스 홈페이지에 화면 교체 킷을 이용하면 다시 정상으로 수리할 수 있을지 궁금해요.

뒷면을 보면 화면이 안 나오는 쪽으로 안에 부품이 다 보이는데, 떨어뜨렸을 때 이쪽에서 작은 금속 조각이 떨어졌던 것 같기도 하지만 기억이 잘 안나요. 떨어진 것 같기도 하고 아무것도 안 떨어진 것 같기도 하고...

답변 감사드려요!

⟐ Answered 6월 11, 2026 at 21:30 GMT-7

⟐ Answered 5월 20, 2026 at 21:32 GMT-7

⟐ Edited by author 1월 26, 2026 at 7:52 GMT-7

The two screws Phillips/Philips 1.7mm screws in the picture are missing.

The name and role of the silver plate for quenching the screws in the picture, and the problem in the absence of the screws

Question - silver plate

1. Name
2. Role
3. Problems in the absence of a latching screw.

⟐ Edited by author 5월 12, 2025 at 9:11 GMT-7

⟐ Answered 3월 12, 2025 at 2:58 GMT-7

⟐ Answered 1월 22, 2025 at 11:13 GMT-7

I replaced the battery of my iPhone 15 Pro myself.

After the replacement, there is some lifting at the top of the screen, and even when pressed, there is a slight gap.

I’m not sure if it’s because of the top speaker grille or incomplete removal of the adhesive.

If you know how to resolve this issue, please let me know.

⟐ Answered 1월 22, 2025 at 10:44 GMT-7

거짓 제품입니다

환불해주세요

⟐ Answered 10월 01, 2024 at 14:33 GMT-7

⟐ Answered 3월 11, 2024 at 9:33 GMT-7

어디를 고쳐야할까요

⟐ Answer accepted 5월 23, 2022 at 1:58 GMT-7

⟐ Answered 8월 18, 2026 at 3:21 GMT-7

⟐ Commented 8월 17, 2026 at 17:14 GMT-7

SoC: A15 Bionic (8110 Rev 11)

iOS Version: 17.4.1 (21E236) / Darwin Kernel 23.4.0

Symptom: Device automatically restarts every 3 minutes in a continuous reboot loop.

Hi iFixit community,

I am troubleshooting an iPhone 14 Plus that triggers a panic-full reboot every 180 seconds. Below is the raw header and panic log extracted from the device:

JSON

{"bug_type":"210","timestamp":"2025-12-19 16:19:54.00 +0300","os_version":"iPhone OS 17.4.1 (21E236)","roots_installed":0,"incident_id":"C00608FF-EE45-4DA6-AE23-78756C421FD2"}
{
  "build" : "iPhone OS 17.4.1 (21E236)",
  "producto" : "iPhone14,8",
  "socId" : "8110",
  "socRevision" : "11",
  "incidente" : "C00608FF-EE45-4DA6-AE23-78756C421FD2",
  "crashReporterKey" : "5fba0fd7ae4562577b1c858df0f36b596b49d9dc",
  "kernel" : "Versión del kernel de Darwin 23.4.0: vie. mar. 8 23:31:19 PST 2024; root:xnu-10063.102.14~67/RELEASE_ARM64_T8110",
  "fecha" : "2025-12-19 16:19:54.81 +0300",
  "panicString" : "panic(cpu 2 caller 0xffffffff03adadde8): SMC PANIC - ASSERTION FAILED: target/d28/target.cpp:266: 0, SMC BSC failure, spreadsheet ver(*10) 40\nS.sensor array 0 - 4 is 0x0, 0x500000, 0x0, 0x0, 0x0 \nF.sensor array 0 is 0x0\n\n - Misc(2) OUTBOX1 not ready\nASSERTION FAILED: target/d28/target.cpp:266: 0, SMC BSC failure, spreadsheet ver(*10) 40\nS.sensor array 0 - 4 is 0x0, 0x500000, 0x0, 0x0, 0x0 \nel array del sensor F.sensor 0 es 0x0\n\nRTKit: RTKit-2419.102.1.release - Cliente: AppleSMCFirmware-4283.102.1.d28.REL\n!UUID: e1e60d6f-ffea-3505-b762-230396fe6490\nTiempo: 0x00000003c6e25e67\n\n"
}

Technical Analysis:

• Hardware Identification: Model identifier iPhone14,8 and target d28 both confirm this is an iPhone 14 Plus.
• Sensor Array Error Code: S.sensor array explicitly flags value 0x500000 (which corresponds to 5242880 in decimal).
• Bus Failure: On the iPhone 14 Plus architecture, 0x500000 is the combined bitmask representing the Dock Flex / Charging Port thermal sensor array (0x100000) combined with the Wireless Charging / Back Glass sensor line (0x400000).
• SMC Assert: The System Management Controller fails communication over the BSC (Bus Status Controller) due to missing SMBus/I2C thermal readings from TAOP/TAOJ.

Local shops suggested a battery replacement, but the panic log contains no battery gauge failures (TG0B, TG0V, or Gas Gauge).

Questions for the community:

1. Has anyone resolved this exact 0x500000 / SMC BSC failure on an iPhone 14 Plus strictly by replacing the Dock Charging Port Flex Cable with an OEM pulled part?
2. Does a missing/damaged Wireless Charging Coil flex connector trigger this entire 0x500000 bitmask on its own, or is the Dock Flex always the primary culprit?
3. If a new OEM Dock Flex does not resolve the panic, which diode readings / filter components near connector J6400 should be checked?

Thank you!

⟐ Answer accepted 8월 17, 2026 at 6:35 GMT-7

⟐ Answered 8월 16, 2026 at 17:27 GMT-7

⟐ Answered 8월 16, 2026 at 9:02 GMT-7

⟐ Answered 8월 16, 2026 at 8:45 GMT-7

I’m an engineer, but I have very limited experience with electronics and board-level repair. I’m hoping to get some advice from people here who have much deeper experience with iPhone hardware, microsoldering and board repair.

I absolutely love the iPhone 13 mini form factor. Unfortunately, Apple no longer makes anything remotely comparable in size, and none of the current iPhones appeal to me because of their size.

So I started thinking about a rather crazy project:

Could we build a modern “iPhone 13 mini V2” by keeping the 13 mini's external dimensions and screen, while replacing as much of the internal electronics as realistically possible with components from a newer iPhone?

The target envelope would be approximately:

131.5 × 64.2 × 10 mm maximum

The original 13 mini is 7.65 mm thick, but I am willing to increase the thickness to around 10 mm if that gives us enough internal volume to make the project realistic and a completely flat back !

The important point is that I would like to keep:

• the 13 mini external dimensions and ergonomics;
• the 5.4" OLED display;
• the original front/TrueDepth assembly if possible;
• Face ID if possible;
• MagSafe;
• the general button and speaker arrangement.

I would like to modernize:

• SoC / processing platform;
• RAM and storage;
• modem / cellular connectivity, if feasible
• Wi-Fi and Bluetooth;
• USB-C;
• battery;
• cameras, if feasible.

The extra thickness would allow the camera modules to be integrated into the body rather than using the large camera bump found on recent iPhones.

I initially considered several generations, but the iPhone 16e currently looks particularly interesting to me because of its modern architecture and A18/C1 platform.

However, I don't want to assume that the 16e is actually the best donor.

An iPhone 15, 16e, or another generation might be much more practical if its hardware is easier to integrate into the 13 mini.

If the objective is:

maximum performance and longevity within the physical volume of an iPhone 13 mini,

which generation would you investigate first?

iPhone 15? 16e? Another model?

And why?

Could the original 13 mini OLED and touchscreen potentially be driven by a newer logic board?

If not directly, is a custom interposer/flex PCB technically realistic?

Or is the display interface effectively a hard stop?

My preference would be to keep the original 13 mini TrueDepth module.

How tightly coupled is the TrueDepth assembly to the original logic board in practice?

Is there any realistic way to make a newer logic board work with the 13 mini TrueDepth system?

I am not proposing to immediately remove the A18 or other BGA components from the board.

My preferred approach would be to keep Apple's critical circuitry intact wherever possible and use custom flex/interposer boards and mechanical adaptations to rearrange the surrounding components.

The extra 2–2.5 mm of thickness would give us considerably more freedom.

Is this a reasonable approach, or am I fundamentally misunderstanding how these boards need to be laid out?

I want to be very transparent about this:

I am a micro mechanical engineer and I am comfortable with mechanical design, measurements, CAD, prototyping and experimental work.

However, I am not an electronics/RF engineer and I have very limited experience with iPhone logic-board repair or microsoldering.

So I am not looking for someone to simply tell me “this is impossible”.

I would really appreciate someone experienced telling me:

“This part is impossible, this part is difficult but achievable, and this is the architecture I would try first.”

I am perfectly happy to start with a sacrificial 13 mini and a damaged donor phone and work progressively from a proof of concept.

Any advice from experienced Apple board-repair technicians, microsoldering specialists or electronics engineers would be extremely valuable.

Thanks!

⟐ Answered 8월 15, 2026 at 4:54 GMT-7