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현재 버전 게시자: BSlash ,

제목:

Question about reball skywork chip

텍스트:

is there thermal grease between both parts of the chip?
 
or is it done by cleaning the gold shining surface and reball it?
 
http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg
 
got the same problem with the chip, it broke into pieces
 
http://www.ifixit.com/Answers/View/108092/Skyworks+SKY77541+module+soldering
 
in the meantime, the new chip arrived and I will try to solder this
 
desolder the nonfunctioning chip. there seems to be only solder on the outside. but what about the contact sufaces in the middle?
 
[image|233038]
 
 
 
[image|233037]
 
 
 
[image|233039]
 
 
 
[image|233040]

기기:

iPhone 4

현황:

open

편집자: BSlash ,

제목:

Question about reball skywork chip

텍스트:

is there thermal grease between both parts of the chip?
 
or is it done by cleaning the gold shining surface and reball it?
 
http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg
 
got the same problem with the chip, it broke into pieces
 
http://www.ifixit.com/Answers/View/108092/Skyworks+SKY77541+module+soldering
 
in the meantime, the new chip arrived and I will try to solder this
 
desolder the nonfunctioning chip. there seems to be only solder on the outside. but what about the contact sufaces in the middle?

기기:

iPhone 4

현황:

open

편집자: BSlash ,

제목:

Question about reball skywork chip

텍스트:

is there thermal grease between both parts of the chip?
 
or is it done by cleaning the gold shining surface and reball it?
 
http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg
 
got the same problem with the chip, it broke into pieces
http://www.ifixit.com/Answers/View/108092/Skyworks+SKY77541+module+soldering
 
in the meantime, the new chip arrived and I will try to solder this

기기:

iPhone 4

현황:

open

편집자: oldturkey03 ,

제목:

Question about reball skywork chip
Question about reball skywork chip

텍스트:

is there thermal grease between both parts of the chip?

or is it done by cleaning the gold shining surface and reball it?

http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg

기기:

iPhone 4

현황:

open

편집자: oldturkey03 ,

제목:

No Title (You should edit this question)Question about reball
No Title (You should edit this question)Question about reball

텍스트:

is there thermal grease between both parts of the chip?

or is it done by cleaning the gold shining surface and reball it?

http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg

기기:

iPhone 4

현황:

open

원문 게시자: BSlash ,

제목:

No Title (You should edit this question)

텍스트:

is there thermal grease between both parts of the chip?

or is it done by cleaning the gold shining surface and reball it?

http://cdn.smartphone-parts.com/images/T/iPhone-4-Power-Amplifier-IC-SKY77541-32-Original-Main-S.jpg

기기:

iPhone 4

현황:

open