원문 게시자: Chris Stables ,
The audio IC is not the problem it is the trace gong from the pad on the board to the resistor. This trace separates from the pad due to flexing. It is safer to re-ball the IC as the solder on the new chips takes a lot more heat to melt and can cause the dreaded “Searching no service” which will require the baseband CPU to be removed and re-balled. If you are not confident in running the trace you could try and just re-flow the chip with some good flux. The heat might give you continuity for a month or so.