원문 게시자: Minho ,
When it comes to reballing IC’s in iPhones/iPads or other smartphones, a solder paste and appropriate stencil is the best way forward. There are plenty of Youtube videos on how to reball IC’s using this technique. I do have an assortment of solder balls, ranging from 0.2mm up to 0.8mm that I use occasionally if only one ball is muffed up. IC’s have different pitches and sizes so you need to have a wide assortment. Those reballing large CPU’s, for example on gaming consoles, will prefer to use solder balls.