iPhone 6s plus Microsoldering u3200 Advice - u3200 wont unstick

I am trying to replace the u3200 of an iphone 6s plus as well as one component at the side of it.

I am a bit new to microsoldering, so i dont know exactly what i am doing wrong.

I managed to peel away the epoxy that was touching it, and the resistor that was at the side of it (it was burnt - water damage)

However, the IC will NOT come up. I have put an ungodly amount of heat to it (started at 300, then to 400, then 420, then 430, then 450 degrees C, and tried with different air flow settings) but nothing helps.

The black cover came off, but the metal connects at the bottom are still attached.

The flux smokes, and the screen i have under the board even starts to burn.

But this darn thing stays stuck like glue.

Tried touching it with the iron and see if it would loosen up some. Nothing.

It is like it is not soldered on - like it is super super super glued.

photos of my progress thus far: IMGUR of Board

Any advice?

Also (not sure if I can ask two questions at the same time)

The component at the side of the u3200. It was fried on the upper end and came lose without any heat. I need to replace that but i dont have a 6s plus donor board.

Can i take a piece off of a 5s and use it in that position? any idea which one?

Thanks in advance!