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2014년 9월 19일에 출시된 이 4.7” 스크린 iPhone은 iPhone 6 Plus의 작은 버전입니다. 모델 번호 A1549, A1586 및 A1589로 식별됩니다.

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A8 chip is getting overly hot after being bent

I Bent my IPhone 6 a while back, and it stopped working immediately (as you would expect), and it was very hot, but I opened it up to find a melted battery. I tried just replacing the battery , (after I had straightened out the housing) and that didn't work and now the are where the A8 chip area is just getting hotter. Does anyone have any suggestions of what could be my problem? I know that bending a phone is normally fatal but I would like to do my best and try and fix it.

Also, is there any methods out there for finding shorts on these small delicate boards like this that i can try?

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Reflowing is generally not recommended, especially for an IC that is underfilled with epoxy (like the CPU). When you heat it, the solder balls expand but they are confined in an epoxy casing so they end up building pressure and eventually explode out from underneath through the tiniest of openings. That causes shorts, bridges, lost contact etc.

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So is there anything I can do?

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Unless you have schematics and the experience required to troubleshoot at the component level...unfortunately no.

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Is there anywhere I could send it maybe to have it looked at/fixed?

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You can send it to Refectio' shop. He does this work for a living, and has done so for quite some time!

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@theimedic totally agree with you. Andy Somsak see if @refectio can help you out.

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Andy Somsak when you bend your phone you most likely also bend your logicboard. Now you could have cracked solder joints, loose components, or traces that are short circuited. Yes, one can check the board but you must have the right tools, schematic and practice to do that. @refectio and @teetopp are a few users who have specialized in this kind of work.

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Thanks for the reply. If it was the solder joints, would reflowing the board with a heat gun maybe fix that? If so do you have any suggestions on that?

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That does not sound like a good idea since we do not know what the damage is. We are guessing it's the solder joints but if it is not you could cause more damage. It is a multilayer board so there are traces that simply cannot be seen but they may have fractured.

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So is there anything I can do?

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Andy Somsak see if @refectio can help you out.

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Since you cant do much more damage to your phone, you might try reflowing your logic board the caveman way. I have saved many graphics cards, a printer controller board, stacks of intermittent wifi routers and a network controller hub this way. Minho raised a valid concern regarding epoxy backfilled flip chip having blowout from the expanding gases under the chip. I did restore a bad ABS brake module with one of these types of chip though. I was lucky.

You probably cracked solder connections between the PCB and components. Hopefully not a chip or passive component itself has fractured.

This is a long shot and if it does work, it is not to be considered permanent in any way. My laptop 2 years later is still working great however. Preheat your oven to 400F. Place the logic board carefully on standoffs of some sort on top of aluminum foil lined pan. Paperclips bent into little stands with hooks to suspend the board horizontally by its mounting holes works excellent. You don't want any components on the bottom to contact the foil.

Bake for 5 minutes. Remove the pan/logic board CAREFULLY from the oven and allow to cool. If it drops or is jarred, you may knock components off as the solder may be wet. With some luck, it may work for you. If not, try again for 8-9 minutes maximum. This is only a last resort vs throwing the board out.

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Will/Could this taint my oven in anyway?

Is there anyway I could do this with a heat gun?

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