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What thermal paste to use after bottom board swap?

Hi guys,

Last night I did a bottom board swap on iPhone X (tried it for the first time and succeeded, very proud of myself :D). After I soldered both logic boards back together I have realised there is no thermal compound inside anymore. I want to do my repairs to the highest possible standards, so I think it's a good idea to apply some thermal paste back where it should be.

My question is what product do you use for it? What type of paste?

Thanks,

Marcin

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If you are going to put thermal paste back on the CPU than Artic silver will be fine. Although I think it would be a waste of time and money as thermal paste will only dissipate the heat when underneath a heatsink. But that is just my opinion.

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IMO, Apple uses a special thermal paste based on Carbon Black. I agree with Chris however, Arctic Silver is fine if you want to go that route.

의

I have used noctua nt-h1, never used it on a phone though. I use it for computers and devices of the sorts

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I only use it cuz it is a lot cheaper and seems to do the trick from a reputable cooling brand

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There is no thermal paste on the motherboard.

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https://prnt.sc/v88lcc

https://prnt.sc/v88lvc

so what is that substance on BB_CPU?

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i did a iPhone X lower board swap, i transferred the Wifi, baseband,eeprom and nfc chip. All was working fine. But once i did iOS Restore, my wifi and bluetooth greyed out. Wifi Address under settings show “N/A”. I need help.

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