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I bought iPhone X middle layer reballing stencil, but I can't find a way to center the boards when I'm putting them back together, if I heat the lower area of upper board and it sticks in place then the upper area lifts up, I think that the upper board has been a bit deformed due to the heat of a heat gun, can I use my flat heating platform to do that kind of job, it's capable of heating up to 300°C
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do you do much reballing as mechanic make a heating platform for different models pretty cheap
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Ok, but is there any tehnique to merge the sandwich board correctly
@dizzyrepair if the top board is disformed you will have issues, if you use 1 of the mechanic heaters it heats from the bottom and pulls the top board down when the solder melts, no top heat is needed when using 1
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