Possible Liquid metal application?
Can I put liquid metal on this processor and all i really need to know is if the ihs is made out of aluminum and is it isnt then i can do it.
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I haven't even seen anyone use liquid metal on these, just thermal pads.
I have been looking for close up images of the SoC because I haven't seen any of these in person disassembled enough to get a good look at it. But I would be exceptionally cautious using liquid metal for a few reasons.
- There is almost no protection from liquid metal dribbling off the sides of the SOC. Liquid metal is electrically conductive and this could mean pretty disastrous results if it gets into the wrong place. There is edge bonding around the top and bottom edges of the CPU, but I don't see any underfill or other protection from liquid metal getting under the CPU.
- Most laptop processors don't have an IHS. It's almost always just a bare die to a heat sink. That's not the case here, but I can't even tell for sure that it has an IHS, even if it's not a bare die. It's difficult to tell from images. But the pictures I could find makes the SoC look very textured. I could just be reading into things, but it mostly looks like a massive package soldered to the board. I would expect an IHS to look more like the inductors in the image below (have R40 written on them) than the NAND (the silvery chip in the lower right)
If you want better thermal performance, a thermal pad may be worth looking into. It's much safer all around.
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To add to @flannelist comments on Liquid Metal TIM in a desktop which is on a level surface I can see the possibility, but a desktop with a vertically mounted logic board would allow the TIM to slowly migrate downwards. That is still assuming the heat sink and the CPU chip are not harmed by the base metal of the TIM which is a compound of gallium, indium, and tin that has a very high thermal conductivity.
Sadly, Indium is a very reactive metal which will damage your logic board and heat sink if either have aluminum or tin. And as Apple uses tin solder in their systems that would be a bad idea to use Liquid Metal TIM.
@flannelist - This series has a aluminum metal cover over the SoC which likely has a thermal conductor between the raw chip and the cover to transfer the heat. Unlike AMD & Intel the M series chips don’t run as hot. That’s not to say they can’t be pushed hard, within the SoC logic there is thermal monitoring to limit overheating linked into SMC.
Thank you for this comment now i know that even if you had some protection such as electrical tape or TG shield liquid metal might damage the soc since it is aluminum
@danj Thanks for the added info! I was having a hard time imagining it didn't have some kind of heat spreader, it just doesn't look like I was imagining.
