소개
After removing the Secondary Board on your device you should be exposed to the speaker. Now you are able to remove them. As a precautions ground yourself to prevent frying the internal components. Also make sure to keep track of screws and label them.
필요한 것
-
-
Use the plastic tool to pry between the silver bezel and the back case
-
Work the tool around the device to free the back case
-
-
-
Use a plastic opening tool to lift the black retaining flap on the ZIF Connector
-
-
-
Using the plastic prying tool, lift the small retaining flap on the ZIF Connectors holding the ribbon cables to the motherboard
-
-
-
-
To remove the ribbon cables, lift up the white retaining flap on the ZIF Connectors with a plastic pry tool
-
To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
팀
USF Tampa, Team 2-2, Cagle Fall 2016 USF Tampa, Team 2-2, Cagle Fall 2016 회원
USFT-CAGLE-F16S2G2
4 회원들
안내서 5개 작성하였습니다
