소개

This guide will explain step by step how to remove the outer cases of the IBM WorkPad c3.

부품

부품은 필요하지 않습니다.

Turn the device over so that the screen is facing down.
  • Turn the device over so that the screen is facing down.

  • In the next step the device will be heated, so the screen must be turned over to prevent heat damage to the LCD/Digitizer.

댓글 쓰기

Using a hair dryer, slowly heat the edges of the WorkPad.
  • Using a hair dryer, slowly heat the edges of the WorkPad.

  • Spend at least one minute heating each side of the device. This will melt the glue holding the case together, and allow it to be removed.

  • Be sure not to touch the device directly after heating as it will be extremely hot. Use a towel or oven mitt to grab it.

댓글 쓰기

  • Use a plastic opening tool to pry the back case from the WorkPad.

  • If the rear cover is not coming off very easily, you probably need to reheat the case in order to sufficiently melt the glue.

댓글 쓰기

결론

To reassemble your device, follow these instructions in reverse order.

Emily Falkenstein

회원 가입일: 2010년 10월 05일

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안내서 5개 작성하였습니다

Cal Poly, Team 21-35, Regan Fall 2010 Cal Poly, Team 21-35, Regan Fall 2010 회원

CPSU-REGAN-F10S21G35

3 회원들

안내서 5개 작성하였습니다

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