부품

부품은 필요하지 않습니다.

Place prying device along the side crease of the phone. Place prying device along the side crease of the phone.
  • Place prying device along the side crease of the phone.

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Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges. Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.
  • Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.

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Remove the back casing from the front casing. Force may be necessary.
  • Remove the back casing from the front casing. Force may be necessary.

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Use prying device to remove motherboard from the back of the phone. Use prying device to remove motherboard from the back of the phone.
  • Use prying device to remove motherboard from the back of the phone.

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결론

To reassemble your device, follow these instructions in reverse order.

Erica

회원 가입일: 2011년 10월 14일

101 평판

안내서 6개 작성하였습니다

James Madison, Team 1-49, Allen Fall 2011 James Madison, Team 1-49, Allen Fall 2011 회원

JMU-ALLEN-F11S1G49

3 회원들

안내서 8개 작성하였습니다

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