부품

부품은 필요하지 않습니다.

Place prying device along the side crease of the phone.
  • Place prying device along the side crease of the phone.

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Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.
  • Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.

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  • Remove the back casing from the front casing. Force may be necessary.

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  • Use prying device to remove motherboard from the back of the phone.

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결론

To reassemble your device, follow these instructions in reverse order.

Erica

회원 가입일: 2011년 10월 14일

101 평판

안내서 6개 작성하였습니다

James Madison, Team 1-49, Allen Fall 2011 James Madison, Team 1-49, Allen Fall 2011 회원

JMU-ALLEN-F11S1G49

3 회원들

안내서 8개 작성하였습니다

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