소개
The adhesive white film is attached to the faceplate of the phone. Removal of this component is necessary to provide access to several underlying components. Removal of the film is simple and requires minimal tools and no prior experience.
필요한 것
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Locate the small button on the top of the phone.
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Depress the button.
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With your other hand, pull the front cover away from the phone.
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Remove all six 5.3 mm long T6 screws.
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Remove the circuit board/faceplate sub-assembly from the back of the phone.
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Hold the faceplate with the adhesive film facing upwards.
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Use the spudger to pry the adhesive film away. This can be done by working the tool back and forth underneath the film.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
팀
Clemson, Team 15-3, Benson Fall 2012 Clemson, Team 15-3, Benson Fall 2012 회원
CLEM-BENSON-F12S15G3
3 회원들
안내서 21개 작성하였습니다
