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소개

The circuit board processes all the information the phone uses. Removing the circuit board allows access to several underlying components.

부품

지정된 부품이 없습니다.

  1. Locate the small button on the top of the phone. Depress the button. With your other hand, pull the front cover away from the phone.
    • Locate the small button on the top of the phone.

    • Depress the button.

    • With your other hand, pull the front cover away from the phone.

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  3. Remove all six 5.3 mm long T6 screws. Remove the circuit board/faceplate sub-assembly from the back of the phone. Take care to place screws in a safe location.
    • Remove all six 5.3 mm long T6 screws.

    • Remove the circuit board/faceplate sub-assembly from the back of the phone.

    • Take care to place screws in a safe location.

  4. Using your fingers, pull the small plastic tab away from the circuit board/faceplate sub-assembly. Rotate the faceplate away from the circuit board. Gently remove the faceplate from the circuit board, taking care to not break the small plastic tab on the other side of the sub-assembly.
    • Using your fingers, pull the small plastic tab away from the circuit board/faceplate sub-assembly.

    • Rotate the faceplate away from the circuit board.

    • Gently remove the faceplate from the circuit board, taking care to not break the small plastic tab on the other side of the sub-assembly.

결론

To reassemble your device, follow these instructions in reverse order.

Parker Niebauer

회원 가입일: 2012년 10월 22일

1 평판

안내서 6개 작성하였습니다

Clemson, Team 15-3, Benson Fall 2012 Clemson, Team 15-3, Benson Fall 2012 회원

CLEM-BENSON-F12S15G3

3 회원들

안내서 21개 작성하였습니다

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