소개
However, the Sony engineers also included a thermal pad to aide heat transfer in their design. These thermal pads can be worn out with excessive use, or severe overheating events. After this, it is best to replace the pads to keep the device performing optimally.
필요한 것
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Use the plastic spudger to pry up the bottom piece of the case to release the clips.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
다른 3명이 해당 안내서를 완성하였습니다.
팀
IUPUI, Team 3-1, Baechle Spring 2016 IUPUI, Team 3-1, Baechle Spring 2016 회원
IUPUI-BAECHLE-S16S3G1
4 회원들
안내서 4개 작성하였습니다
