주요 콘텐츠로 건너뛰기

#15단계의 변경 사항

David Hodson- 에 의해 수정

편집 승인됨 완료자 David Hodson

이전
이후
변경 사항이 없습니다

단계 라인

[* black] More chips on the underside of the logic board:
[* red] Qualcomm PM8018 RF power management IC
[* yellow] Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash
- [* orange] Apple 338S1131 Dialog Semi Power Management IC
- [* green] Apple 338S1117 (Chipworks believes this to be an Elpida memory MCP for LTE.
+ [* orange] Apple 338S1131 dialog power management IC*
+ [* green] Apple 338S1117 Elpida memory MCP for LTE*
[* blue] STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones
[* violet] Murata 339S0171 Wi-Fi module
+[* black] *Our buddies at Chipworks are making well-informed hypotheses here, and they're pretty good at what they do.