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#2단계의 변경 사항

Gordon Kuo- 에 의해 수정

편집 승인됨 완료자 Gordon Kuo

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변경 사항이 없습니다

단계 라인

[* black] Using a pry tool, gently pry the heat sink assembly up.
[* icon_reminder] Be sure to reapply thermal compound on the processor and heat sink when reassembling the device.
[* icon_caution] Be aware of thethat there still is a wire attachingattached to the fan that is connected to the motherboard upon removal.
[* icon_caution] Be aware of thethat there still is a wire attachingattached to the fan that is connected to the motherboard upon removal.