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#6단계의 변경 사항

Thomas Widmaier- 에 의해 수정

편집 승인됨 완료자 Thomas Widmaier

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변경 사항이 없습니다

단계 라인

[title] Solder new socket
[* black] When new SIM-socket arrives, optionally add solder to the pins first. I had a socket that did not solder well due to oxidization. Especially the eight small signal pins must have good connection.
[* red] The Socket has eight signal pins at the card-inserting side, several pads for shield and two pads at the rear side for SIM-inserted detection.
[* green] Place socket on the board and solder at one shield edge first to make a stable position.
[* black] Now solder the eight signal pins at PCB edge. Use steady hand or something to steady your hand. If you bridge some pins DO NOT PANIC, us solder wick to remove additional solder.
[* black] Use magnifying glass or microscope if necessary. I used both because the contact area of the signal pads is tiny and even if it looks ok, it might not have contact to the PCB.
[* black] Before soldering all shield pads, check if system is working ! I had to re-solder the socket three times because of corroded pins.
[* black] One can test the device OPEN (but with PCB and battery in place) to see if 3G works. Beware that WiFi is bad because no antenna (Antenna is on back cover)

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