Nintendo DSi XL Teardown 단계 #20 기록

#20단계의 변경 사항

편집자 Miroslav Djuric- 2010년 3월 28일

	[* black] Samsung and Fujitsu chips are identical to the DSi:
	[* violet] Samsung 1st generation MoviNAND KMAPF0000M: 256 MB NAND Flash and MMC controller. The integrated MMC controller allows the CPU to offload the complex work of directly talking to the flash memory.
	[* blue] 82DBS08164D-70L: Fujitsu Ltd 128-bit FCRAM (fast-cycle RAM) chip.
-	[* red] TI (TXN) 72071B0 power managing and charging circuit.
-	[* black] This was a Mitsumi chip in the DSi we took apart.
-	[* yellow] PAIC3005B Primary Antenna Interface Controller.
-	[* green] Primary Nintendo ARM CPU, manufactured the last week of 2009.
-	[* black] This chip is marked identically to the DSi, definitely not the Tegra chip that had been rumored.
+	[* red] TI (TXN) 72071B0 power managing and charging circuit. This used to me a Mitsumi chip in the smaller DSi.
+	[* yellow] PAIC3005B: We assume it stands for Primary Antenna Interface Controller, given that it's located right by the antenna.
+	[* green] Primary Nintendo ARM CPU, manufactured the last week of 2009. This chip's markings are identical to the DSi. It's definitely not the Tegra chip that had been rumored.
+	[* black] Here's a couple of large photos of the [link\|http://s2.guide-images.ifixit.com/igi/ZLZvDLfH1fRti1xj\|front] and [link\|http://s1.guide-images.ifixit.com/igi/Jti6BvoJIBBqRSxQ\|back] of the logic board. Warning for 56K users: we mean *large*.