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#7 단계의 변경 사항

Kristen Gismondi- 에 의해 수정

편집 승인됨 에 의해 Kristen Gismondi

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[* black] We pull out the G4's motherboard and get a better view it'sof its silicon. Check out these ICs:
[* black] We pull out the G4's motherboard and get a better view it'sof its silicon. Check out these ICs:
[* red] Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM
[* red] The Hexa-Core, 1.8GHz Qualcomm [https://www.qualcomm.com/products/snapdragon/processors|Snapdragon 808|new_window=true] SOC is layered beneath the RAM.
[* orange] Toshiba [http://www.toshiba.com/taec/news/press_releases/2014/memy_14_725.jsp|THGBMFG8C4LBAIR|new_window=true] 32GB NAND Flash
[* yellow] Broadcom [http://www.broadcom.com/products/wireless-connectivity/wireless-lan/bcm4339|BCM4339HKUBG|new_window=true] 5G WiFi Client
[* green] Qualcomm PMI8994 Power Management IC
[* black] IDT [http://www.idt.com/products/power-management/wireless-charging-ics-wireless-power-ics/wireless-power-receivers/p9025a-ultra-compact-qi-wireless-power-receiver-ic|P9025A|new_window=true] Qi Wireless Power Receiver IC