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#7단계의 변경 사항

편집자 cityzen-

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변경 사항 없음

단계 라인

-[* black] After removing a soldered EMI shield, we find wireless connectivity provided by a Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4331|BCM4331] "wireless solution."
-[* black] According to Broadcom, this chip provides "three transmitting and three receiving streams of data in both the 2.4Ghz and 5Ghz bands. Increased number of streams and antennas results in faster speeds, longer range, fewer dropped connections, and better overall wireless coverage."
+[* black] After removing a soldered EMI shield, we find wireless connectivity provided by a Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4331|BCM4331] "wireless solution." In addition, there is a BCM2070 "Single-Chip Bluetooth® 3.0 HCI Solution."
+[* black] According to Broadcom, the BCM4331 provides "three transmitting and three receiving streams of data in both the 2.4Ghz and 5Ghz bands. Increased number of streams and antennas results in faster speeds, longer range, fewer dropped connections, and better overall wireless coverage."
+[* black] Three of the antenna connectors are routed to the BCM4331 wifi chip, while the forth goes to the BCM2070 Bluetooth chip.
[* black] The wireless card bracket is aluminum, rather than the plastic in previous revisions. Perhaps this change was made for thermal reasons, as a visible pink thermal pad is used to transfer heat from the board to its aluminum bracket.