#7단계의 변경 사항
편집자 Seth Goldberg-
- 이전
- 이후
- 변경 사항 없음
단계 라인
| - | [* black] After removing a soldered EMI shield, we find wireless connectivity provided by a Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4331|BCM4331] "wireless solution." |
|---|---|
| - | [* black] According to Broadcom, this chip provides "three transmitting and three receiving streams of data in both the 2.4Ghz and 5Ghz bands. Increased number of streams and antennas results in faster speeds, longer range, fewer dropped connections, and better overall wireless coverage." |
| + | [* black] After removing a soldered EMI shield, we find 802.11n wireless connectivity provided by a Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4331|BCM4331] "Single-Chip 802.11n Dual-Band 3x3 Wireless Solution." Bluetooth 3.0 support is handled by a BCM2070 in a separate, shielded section of the board. |
| + | [* black] According to Broadcom, the BCM4331 chip provides "three transmitting and three receiving streams of data in both the 2.4Ghz and 5Ghz bands. Increased number of streams and antennas results in faster speeds, longer range, fewer dropped connections, and better overall wireless coverage." |
| + | [* black] The BCM2070 Bluetooth controller is described as follows on the Broadcom site: "The Broadcom BCM2070 is a monolithic, single-chip, stand-alone baseband processor with a high performance integrated 2.4-GHz RF transceiver. It is fully compliant with Bluetooth 3.0 and all prior standard features...using advanced 65-nm LP CMOS technology," |
| [* black] The wireless card bracket is aluminum, rather than the plastic in previous revisions. Perhaps this change was made for thermal reasons, as a visible pink thermal pad is used to transfer heat from the board to its aluminum bracket. |