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#6 단계의 변경 사항

Dinan Blueje- 에 의해 수정

편집 거부됨 에 의해 Adam O'Camb

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스텝 라인

[* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
[* black] Here are the front-side chips:
[* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM Likely with Octa-Core processor layered underneath
[* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM Likely with Octa-Core processor layered underneath
[* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=true] 32 GB eMMC flash memory
[* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC
[* green] HiSilicon Hi6402 audio codec