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#8단계의 변경 사항

Phillip Takahashi- 에 의해 수정

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단계 라인

[* black] There appears to be a rather large hole in the middle of the motherboard... but we'll assume it was put there on purpose and proceed to ID the chips orbiting said large hole:
[* blackred] SanDisk SDIN5C1-16G 16 GB Memory
[* blackorange] Texas Instruments [http://www.ti.com/product/twl6030|6030B107] Fully Integrated Power Management IC
[* blackyellow] Texas Instruments [http://www.ti.com/product/tlv320aic3100|AIC3100] Low-Power Audio Codec With 1.3W Stereo Class-D Speaker Amplifier
[* green] Texas Instruments [http://www.ti.com/product/sn75lvds83b|LVDS83B] FlatLink 10-135 MHz Transmitter
[* blue] Hynix H9TKNNN8P 1 GB of Mobile DDR2 RAM. This chip likely covers the Texas Instruments OMAP 4430 1 GHz dual-core processor, just like the [guide|7099|Fire|stepid=30262]
[* blackred] SanDisk SDIN5C1-16G 16 GB Memory
[* blackorange] Texas Instruments [http://www.ti.com/product/twl6030|6030B107] Fully Integrated Power Management IC
[* blackyellow] Texas Instruments [http://www.ti.com/product/tlv320aic3100|AIC3100] Low-Power Audio Codec With 1.3W Stereo Class-D Speaker Amplifier
[* green] Texas Instruments [http://www.ti.com/product/sn75lvds83b|LVDS83B] FlatLink 10-135 MHz Transmitter
[* blue] Hynix H9TKNNN8P 1 GB of Mobile DDR2 RAM. This chip likely covers the Texas Instruments OMAP 4430 1 GHz dual-core processor, just like the [guide|7099|Fire|stepid=30262]

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