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#11단계의 변경 사항

Miroslav Djuric- 에 의해 수정

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단계 라인

[* black] The main logic board. There's a lot packed in here. Here's a [link|http://s1.guide-images.ifixit.com/igi/hsa3HpY6I2UNWjYJ|high-res] image of this shot.
[* black] The Apple-logo chip is the primary Samsung ARM processor.
[* black] The 16 gigabytesGB of Toshiba flash are now on the front of the board, just below the Samsung ARM.
[* black] phoneWreck sent us a great component diagram (second picture). They performed a [http://www.phonewreck.com/2009/06/19/iphone-3gs-teardown-and-analysis/|thorough chip analysis] of the iPhone 3G S, so check out their site!
[* black] The 16 gigabytesGB of Toshiba flash are now on the front of the board, just below the Samsung ARM.
[* black] phoneWreck sent us a great component diagram (second picture). They performed a [http://www.phonewreck.com/2009/06/19/iphone-3gs-teardown-and-analysis/|thorough chip analysis] of the iPhone 3G S, so check out their site!

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