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#8단계의 변경 사항

Jeff Suovanen- 에 의해 수정

편집 승인됨 완료자 Jeff Suovanen

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변경 사항이 없습니다

단계 라인

-[* black] Warranty void stickers on the heat sink? That's odd, could that mean...
-[* black] Yes! The CPU is modular! The non-soldered Kaby Lake rumors appear to hold true even for apple products.
+[* black] This new heat sink design has us intrigued. What's hiding under there?
+[* black] Warranty voiding stickers on the heat sink screws? That's odd. Could that mean...
+[* black] Yes! The CPU is modular, too! It lifts right off with the heat sink, revealing a standard LGA 1151 CPU socket.
+[* icon_reminder] Again, this isn't the most accessible thing in the world—it's flipped onto the backside of the logic board, trapped behind a lot of other components, and buried under a glued-down pane of glass—but for the first time in years it's ''possible'' to replace or upgrade the CPU without a reflow station, and that's a big win.