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#9 단계의 변경 사항

Adam O'Camb- 에 의해 수정

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[* black] Use a detailsoft brush (like a toothbrush or [product|IF145-062|detailing brush|new_window=true]) to gently scrub away any corrosion and liquid residue on the logic board and other components.
[* icon_caution] Be carful notIt's possible to push downbreak small solder joints with too hard withmuch force from the brush on delicate logic board componentsbrush. Use just enough force to remove the corrosion and residue.
[* black] Use a detailsoft brush (like a toothbrush or [product|IF145-062|detailing brush|new_window=true]) to gently scrub away any corrosion and liquid residue on the logic board and other components.
[* icon_caution] Be carful notIt's possible to push downbreak small solder joints with too hard withmuch force from the brush on delicate logic board componentsbrush. Use just enough force to remove the corrosion and residue.
[* icon_note] Pay special attention to cable ends, battery contacts, connectors, pins, and fuses as these parts are prone to corrosion and can easily cause the phone to malfunction.
[* black] Keep the logic board and any other alcohol-covered components over a cloth to avoid spilling any alcohol. Contact withcloth. There's a chance the alcohol can damage certain materialsor mark your work surface.
[* black] If needed, repeat steps 98 and 109 until all corrosion and residue is gone.
[* black] Keep the logic board and any other alcohol-covered components over a cloth to avoid spilling any alcohol. Contact withcloth. There's a chance the alcohol can damage certain materialsor mark your work surface.
[* black] If needed, repeat steps 98 and 109 until all corrosion and residue is gone.