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#9 단계의 변경 사항

Jeff Suovanen- 에 의해 수정

편집 승인됨 에 의해 Jeff Suovanen

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[* black] Use a soft brush (like a toothbrush or [product|IF145-062|detailing brush|new_window=true]) to gently scrub away any corrosion and liquid residue on the logic board and other components.
[* icon_caution] It's possible to break small solder joints with too much force from the brush. Use just enough force to remove the corrosion and residue.
[* icon_note] Pay special attention to cable ends, battery contacts, connectors, pins, and fusesfuses, as these parts are prone to corrosion and can easily cause the phone to malfunction.
[* icon_note] Pay special attention to cable ends, battery contacts, connectors, pins, and fusesfuses, as these parts are prone to corrosion and can easily cause the phone to malfunction.
[* black] Keep the logic board and any other alcohol-covered components over a cloth. There's a chance the alcohol can damage or mark your work surface.
[* black] If needed, repeat steps 8 and 9 until all corrosion and residue is gone.