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도움말
2단계 편집 중 —

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 3개에 영향을 미칩니다.

단계 유형:

끌어서 재배열 합니다

Once all the screws are removed, slowly and carefully lift off the back plate. Do this by inserting a spudger between the front and back plates of the device on both sides of the phone.

Once back plate is lifted, the small, silver volume and camera buttons located on the sides of the device will fall off. They are only connected to the phone by the back plate. Remove and do not lose these pieces.

Locate the cover of the head phone jack. The cover is silver and circular and has a headphone image on the front of it. Open the cover to the headphone jack and peel it off the device. Do not lose this piece.

Be careful when taking the shell apart, as the wire that connects the external speaker and the logic board can break if too much force is applied.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.