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iPhone 7 분해도

13 단계
iPhone 7 Teardown: 0 단계, 이미지 1개 중 1개
  • It wouldn't be a teardown without a ton of silicon! Here's what we uncover on the logic board:

  • Apple A10 Fusion APL1W24 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10CM-YGCH)

  • Qualcomm MDM9645M LTE Cat. 12 Modem

  • Skyworks SKY78100-20 Power Amplifier Module

  • Avago AFEM-8065 Power Amplifier Module

  • Avago AFEM-8055 Power Amplifier Module

  • Murata 025 Antenna Switch Module (likely)

  • Invensense Accelerometer

많은 실리콘 없다면 분해라고 할 수 없습니다! 다음은 로직 보드에서 밝혀낸 내용입니다:

Apple A10 Fusion APL1W24 SoC + Samsung 2GB LPDDR4 RAM (K3RG1G10CM-YGCH 표시)

Qualcomm MDM9645M LTE Cat. 12 모뎀

Skyworks 78100-20

Avago AFEM-8065 전력 증폭기 모듈

Avago AFEM-8055 전력 증폭기 모듈

[* black] It wouldn't be a teardown without a ton of silicon! Here's what we uncover on the logic board:
[* red] Apple A10 Fusion APL1W24 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10CM-YGCH)
[* orange] Qualcomm [https://www.qualcomm.com/products/snapdragon/modems/x12|MDM9645M|new_window=true] LTE Cat. 12 Modem
- [* yellow] Skyworks 78100-20
+ [* yellow] Skyworks SKY78100-20 Power Amplifier Module
[* green] Avago AFEM-8065 Power Amplifier Module
[* light_blue] Avago AFEM-8055 Power Amplifier Module
+ [* blue] Murata 025 Antenna Switch Module (likely)
+ [* violet] Invensense Accelerometer

귀하의 기여는 오픈 소스 Createive Commons 라이선스 하에 허가되었습니다.