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6단계 편집 중 —

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 사용하는 안내서에 영향을 미칩니다.

단계 유형:

끌어서 재배열 합니다

It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink. At this point, the heat sink should come free easily.

If necessary, use a spudger to pry up the heat sink from the left side near the hard drive.

While lifting straight up on the hinge grill with your right hand, lift the heat sink with your left hand from the end nearest the hard drive and remove the heat sink assembly from the computer.

The hinge grill is held captive by the display assembly/clutch cover, and can only be partially raised.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.