주요 콘텐츠로 건너뛰기

기기를 고치세요

수리할 권리

부품 & 도구

소개

When dealing with iPhone XS motherboard issues, the double layered motherboard needs to be desoldered&resoldered. The phone might get stuck in won’t turn on issue due to pseudo soldering caused by improper layer alignment or uneven heating during the process. Well, our repair guide today shall enlighten you. iPhone XS won’t turn on repair with the help of an easy operated heating platform that can heat the board safely and evenly. Also, for repair technicians, it’s important for you to understand how iPhone boot circuit works before starting your repair work.

동영상 개요

  1. Hold the power button to turn on the phone. There is no response from the phone.
    • Hold the power button to turn on the phone. There is no response from the phone.

    • Take apart the phone and take out the motherboard.

    • Measure the boot current first. The current pointer moves from 0 to 100mA, then 0, back and forth.

    • Judging by this, the upper layer or the third space PCB has malfunctioned.

  2. Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.
    • Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.

    • With the whole upper layer being loose, pick up the upper layer with tweezers. Continue to take the lower layer off the platform.

  3. Nintendo Switch 키트

    게임으로 돌아가기 위한 빠른 해결책

    Nintendo Switch 키트 쇼핑하기

    Nintendo Switch 키트

    게임으로 돌아가기 위한 빠른 해결책

    Nintendo Switch 키트 쇼핑하기
  4. Connect the upper layer with the Power Supplier.
    • Connect the upper layer with the Power Supplier.

    • Judging by the reading on the ammeter, the upper layer can be powered up normally. So the fault might be related to the third space PCB.

  5. We need to re-solder the upper layer with the third space PCB.
    • We need to re-solder the upper layer with the third space PCB.

    • Attach the upper layer and the lower layer to the Holder. Clean the third space PCB with Soldering Iron. Clean with PCB Cleaner afterwards.

  6. First, we need to reball the lower layer.
    • First, we need to reball the lower layer.

    • Then, attach the reball finished lower layer to the heating platform and get the upper layer in position.

    • Once the two layers have been soldered together, wait for the double-stacked motherboard to cool for 10 minutes.

  7. Now we can assemble the phone and test. Hold the power button to turn on the phone. The phone turns on normally.
    • Now we can assemble the phone and test. Hold the power button to turn on the phone. The phone turns on normally.

결승점

다른 한 분이 해당 안내서를 완성하였습니다.

Phryne

회원 가입일: 2019년 11월 17일

8,008 평판

안내서 62개 작성하였습니다

댓글 쓰기

조회 통계:

24 시간 전: 7

7일 전: 38

30일 전: 148

전체 시간: 659