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华为 Mate 10 Pro 拆解

12 단계
Huawei Mate 10 Pro Teardown: 0 단계, 이미지 2개 중 1개 Huawei Mate 10 Pro Teardown: 0 단계, 이미지 2개 중 2개
  • Our long journey nears its finale with a close look at the chipset of the Mate 10 Pro!

  • 4 GB (optionally 6 GB) of Samsung RAM (K3UH6H60AM-EGCJ), with the new Kirin 970 SoC layered underneath

  • The Kirin 970 SoC features two quad-core CPU (Cortex A73 and Cortex A53), the Mali-G72 GPU and a dedicated NPU (Neural Processing Unit)

  • Toshiba THGAF4T0N8LBAIR 128 GB NAND flash memory

  • NXP Semiconductor PN548 NFC controller

  • Skyworks SKY7360-2A RF module

  • HiSilicon Hi6523 battery charger

  • ON Semiconductor NCP392D overvoltage protection controller

我们的探索之路的压轴戏马上就要由 Mate 10 Pro 的芯片组上演了!

4 GB(可选6 GB)三星内存,新的麒麟970处理器在其下方。

麒麟970处理器拥有2组各4核心的中央处理器(Cortex-A73 和 Cortex-A53),Mali-G72 图形处理器和一个独立神经网络处理器。

东芝 128 GB 闪存

恩智浦 PN548 NFC控制器

Skyworks 7360-2A无线电模块

海思 Hi6523 电池充电芯片

[* black] Our long journey nears its finale with a close look at the chipset of the Mate 10 Pro!
- [* red] 4 GB (optionally 6 GB) of Samsung RAM, with the new Kirin 970 SoC layered underneath
+ [* red] 4 GB (optionally 6 GB) of Samsung RAM (K3UH6H60AM-EGCJ), with the new [link|https://www.hisilicon.com/en/products/Kirin/Kirin-flagship-chips/Kirin%20970|Kirin 970] SoC layered underneath
[* icon_note] The Kirin 970 SoC features two quad-core CPU (Cortex A73 and Cortex A53), the Mali-G72 GPU and a dedicated NPU (Neural Processing Unit)
- [* orange] Toshiba 128 GB NAND Flash memory
- [* yellow] NXP PN548 NFC controller
- [* green] Skyworks 7360-2A RF module
- [* light_blue] HiSilicon HI6523 battery charger
+ [* orange] Toshiba THGAF4T0N8LBAIR 128 GB NAND flash memory
+ [* yellow] NXP Semiconductor PN548 NFC controller
+ [* green] Skyworks SKY7360-2A RF module
+ [* light_blue] HiSilicon Hi6523 battery charger
+ [* blue] ON Semiconductor [link|https://www.onsemi.com/products/isolation-protection-devices/voltage-protection/ncp392d|NCP392D] overvoltage protection controller

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