주요 콘텐츠로 건너뛰기

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 4개에 영향을 미칩니다.

3 단계
Slide the pick along the side of the phone to cut the adhesive securing the rear panel. Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener. Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.
  • Slide the pick along the side of the phone to cut the adhesive securing the rear panel.

  • Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

여기에 번역 삽입

여기에 번역 삽입

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.