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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 13개에 영향을 미칩니다.

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In the following steps, extra caution is required in certain areas to avoid damage to the phone: Do not insert the pick more than 9 mm into the bottom edge of the phone. If the pick contacts the folded portion of the OLED panel it can damage the display.

  • In the following steps, extra caution is required in certain areas to avoid damage to the phone:

  • Do not insert the pick more than 9 mm into the bottom edge of the phone. If the pick contacts the folded portion of the OLED panel it can damage the display.

  • Only make very shallow cuts in the upper left corner, prying deeply can damage the front-facing camera.

  • Inserting an opening tool deeper than 1.5 mm into the sides of the device, or 9 mm into the top and bottom can permanently damage the display.

En los siguientes pasos, usa precaución adicional en ciertas áreas para evitar dañar el teléfono:

No insertes la púa más de 6 mm dentro del borde inferior del teléfono. Si la púa contacta la porción doblada del panel OLED, la pantalla puede resultar dañada.

Solo haz cortes muy poco profundos en la esquina izquierda superior. Hacer palanca muy profundamente puede dañar la cámara frontal.

Insertar una herramienta de apertura de más de 1.5 mm en los lados del dispositivo o de 9 mm en la parte superior e inferior puede dañar permanentemente la pantalla.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.