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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 8개에 영향을 미칩니다.

영어
스페인어

1 단계 번역 중

1 단계
In the following steps you'll be cutting through the adhesive that adheres the rear glass panel to the phone. For reference, the backside of the panel is shown in the first photo. Note the clearance between the edge of the panel and the fragile ribbon cable beside the fingerprint sensor. Be careful as you slice and pry to the left side of the fingerprint sensor, as seen from the outside of the phone in the third photo.
  • In the following steps you'll be cutting through the adhesive that adheres the rear glass panel to the phone.

  • For reference, the backside of the panel is shown in the first photo. Note the clearance between the edge of the panel and the fragile ribbon cable beside the fingerprint sensor.

  • Be careful as you slice and pry to the left side of the fingerprint sensor, as seen from the outside of the phone in the third photo.

  • Inserting an opening tool more than 3 mm into the phone in this area can damage or tear the fingerprint sensor cable.

En los siguientes pasos, cortarás el adhesivo que adhiere el panel de cristal trasero al teléfono.

Como referencia, la parte trasera del panel se muestra en la primera foto. Observa la distancia entre el borde del panel y el frágil cable plano junto al sensor de huellas digitales.

Ten cuidado al cortar y hacer palanca en el lado izquierdo del sensor de huellas digitales, tal como se ve desde el exterior del teléfono en la tercera foto.

Insertar una herramienta de apertura de más de 3 mm en el teléfono en esta área puede dañar o desgarrar el cable del sensor de huellas digitales.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.