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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 3개에 영향을 미칩니다.

7 단계 번역 중

7 단계
When reassembling your device, be sure the heat sink's rubber gasket is installed correctly. The nub on the gasket should mate with the hole cut into the logic board near the heat sink fins. The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board. Make sure the antenna cables are inserted into their respective notches on the logic board, as highlighted in the last picture.
  • When reassembling your device, be sure the heat sink's rubber gasket is installed correctly. The nub on the gasket should mate with the hole cut into the logic board near the heat sink fins.

  • The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board.

  • Make sure the antenna cables are inserted into their respective notches on the logic board, as highlighted in the last picture.

Achte beim Zusammenbau darauf, dass die Gummidichtung des Kühlkörpers richtig eingesetzt ist. Die Noppe an der Dichtung muss in den Einschnitt im Logic Board nahe den Kühlrippen passen.

Das Ende der Dichtung sollte in den Einschnitt im Kühlkörper passen, es sollte nicht unter der Lasche am Kühlkörper abschließen, die auf dem Logic Board aufliegt.

Achte darauf, dass die Antennenkabel richtig in ihre Einbuchtungen auf dem Logic Board eingesetzt sind, so wie im letzten Bild zu sehen.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.