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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 3개에 영향을 미칩니다.

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7 단계 번역 중

7 단계
When reassembling your device, be sure the heat sink's rubber gasket is installed correctly. The nub on the gasket should mate with the hole cut into the logic board near the heat sink fins. The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board. Make sure the antenna cables are inserted into their respective notches on the logic board, as highlighted in the last picture.
  • When reassembling your device, be sure the heat sink's rubber gasket is installed correctly. The nub on the gasket should mate with the hole cut into the logic board near the heat sink fins.

  • The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board.

  • Make sure the antenna cables are inserted into their respective notches on the logic board, as highlighted in the last picture.

Lors du remontage de votre appareil, assurez-vous que le joint en caoutchouc du dissipateur thermique est installé correctement. Le petit pic sur le joint devrait correspondre au trou dans la carte mère près des ailettes du dissipateur thermique.

La pic du joint devrait rentrer dans l'encoche du dissipateur thermique, il ne devrait pas finir sous l'onglet du dissipateur thermique qui se trouve sur la carte mère.

Assurez-vous que les câbles d'antenne sont insérés dans leur encoche respective sur la carte mère, comme indiqué dans la dernière image.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.