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상점

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 8개에 영향을 미칩니다.

22 단계 번역 중

22 단계
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

In den nächsten Schritten benötigst du einen iOpener, um mit Hilfe von Wärme die Klebeverbindung des Logic Boards am Gehäuse aufzuweichen.

Jedesmal, wenn du den iOpener neu erwärmst und auf die angezeigten Stellen legst, solltest du ihn mindestens eine Minute dort liegen lassen, um durch das Gehäuse den Klebstoff zu erweichen.

Die Klebeverbindung besteht aus sechs Stück Klebeschaumstoffband. Schaue bei der Arbeit immer wieder auf diesen Schritt, damit du weißt, wo sich die einzelnen Klebestreifen befinden.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.