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상점

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 8개에 영향을 미칩니다.

영어
스페인어

22 단계 번역 중

22 단계
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

En los próximos pasos, usarás un iOpener para aplicar calor a la carcasa trasera del iPad para ablandar el adhesivo que mantiene la placa lógica en su lugar.

A medida que recalientas y colocas el iOpener en cada una de las ubicaciones indicadas, déjalo en su lugar durante al menos un minuto para ablandar el adhesivo a través de la carcasa trasera.

El adhesivo tiene la forma de seis piezas de cinta de espuma negra; consulta este paso mientras trabajas calentando y haciendo palanca para realizar un seguimiento de dónde se encuentra cada pieza.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.