주요 콘텐츠로 건너뛰기

기기를 수리하세요

수리할 권리

상점

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 8개에 영향을 미칩니다.

영어
프랑스어

22 단계 번역 중

22 단계
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

Dans les prochaines étapes, vous utiliserez un iOpener pour chauffer la coque arrière de l'iPad et ramollir l'adhésif maintenant la carte mère en place.

Lorsque vous réchauffez et placez l'iOpener à chacun des emplacements indiqués, laissez-le en place pendant au moins une minute pour ramollir l'adhésif à travers la coque.

L'adhésif se présente sous la forme de six morceaux de ruban de mousse noire – reportez-vous à cette étape pendant que vous vous occupez de réchauffer et décoller pour savoir où se trouve chaque morceau.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.