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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 3개에 영향을 미칩니다.

영어
스페인어

6 단계 번역 중

6 단계
Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM. These tabs lock the chip in place and releasing them will cause the chip to "pop" up.
  • Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM.

  • These tabs lock the chip in place and releasing them will cause the chip to "pop" up.

  • After the RAM chip has popped up, pull it straight out of its socket.

  • Repeat this process if a second RAM chip is installed.

  • Logic board remains.

  • If you need to mount the heat sink back onto the logic board, we have a thermal paste guide that makes replacing the thermal compound easy.

Suelte las pestañas en cada lado del chip RAM al empujar simultáneamente cada pestaña de la memoria RAM.

Suelte las pestañas en cada lado del chip RAM al empujar simultáneamente cada pestaña de la memoria RAM.

Estas pestañas bloquean el chip en su lugar y su liberación hará que el chip "salte".

Después de que el chip RAM haya aparecido, sáquelo directamente de su zócalo.

Repita este proceso si hay un segundo chip RAM instalado.

La placa lógica permanece. Si necesita volver a colocar el disipador de calor en la placa lógica, tenemos unaguía de pasta térmicaque facilita el reemplazo del compuesto térmico.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.