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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 3개에 영향을 미칩니다.

영어
프랑스어

6 단계 번역 중

6 단계
Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM. These tabs lock the chip in place and releasing them will cause the chip to "pop" up.
  • Release the tabs on each side of the RAM chip by simultaneously pushing each tab away from the RAM.

  • These tabs lock the chip in place and releasing them will cause the chip to "pop" up.

  • After the RAM chip has popped up, pull it straight out of its socket.

  • Repeat this process if a second RAM chip is installed.

  • Logic board remains.

  • If you need to mount the heat sink back onto the logic board, we have a thermal paste guide that makes replacing the thermal compound easy.

Débloquez les onglets de chaque côté de la barrette de RAM en poussant simultanément chaque onglet de la RAM.

Ces onglets verrouillent la barrette en place et les débloquer la fera sortir.

Une fois que la barrette de RAM est sortie, tirez-la tout droit hors de sa prise.

Répétez ce processus si une deuxième barrette de RAM est installée.

La carte mère demeure.

Si vous devez monter le dissipateur de chaleur sur la carte mère, nous avons un tutoriel d'application de pâte thermique qui permet de remplacer facilement ce composant thermique.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.