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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 2개에 영향을 미칩니다.

영어
스페인어

23 단계 번역 중

23 단계
Insert a plastic opening tool underneath the logic board, inside the rectangular cut out, and gently pry the logic board up. Slide the opening tool down the length of the gap while continuing to pry the logic board up. Lift the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.
  • Insert a plastic opening tool underneath the logic board, inside the rectangular cut out, and gently pry the logic board up.

  • Slide the opening tool down the length of the gap while continuing to pry the logic board up.

  • Lift the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

Inserta una herramienta de apertura de plástico debajo de la placa lógica, dentro del corte rectangular, y levanta suavemente la placa lógica.

Desliza la herramienta de apertura hacia abajo a lo largo del espacio mientras continúas levantando la placa lógica.

Levanta la placa lógica lentamente. Si encuentras una resistencia significativa, deja de apalancar y vuelve a aplicar el iOpener.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.