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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 2개에 영향을 미칩니다.

영어
프랑스어

23 단계 번역 중

23 단계
Insert a plastic opening tool underneath the logic board, inside the rectangular cut out, and gently pry the logic board up. Slide the opening tool down the length of the gap while continuing to pry the logic board up. Lift the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.
  • Insert a plastic opening tool underneath the logic board, inside the rectangular cut out, and gently pry the logic board up.

  • Slide the opening tool down the length of the gap while continuing to pry the logic board up.

  • Lift the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

Insérez un outil d'ouverture en plastique sous la carte mère, à l'intérieur de la découpe rectangulaire, et faites délicatement levier pour soulever la carte mère.

Faites glisser l'outil d'ouverture le long de l'espace tout en continuant à faire levier sur la carte mère.

Soulevez lentement la carte mère. Si vous rencontrez une résistance importante, arrêtez de faire levier et réappliquez l'iOpener.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.