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알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 2개에 영향을 미칩니다.

영어
프랑스어

24 단계 번역 중

24 단계
Insert an opening tool underneath the logic board on the other side of the rectangular cut out and pry it up. Slide the opening tool down the length of the gap while continuing to pry the logic board up. Lift the the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.
  • Insert an opening tool underneath the logic board on the other side of the rectangular cut out and pry it up.

  • Slide the opening tool down the length of the gap while continuing to pry the logic board up.

  • Lift the the logic board slowly. If you encounter significant resistance, stop prying and reapply the iOpener.

Insérez un outil d'ouverture sous la carte mère de l'autre côté de la découpe rectangulaire et faites levier.

Faites glisser l'outil d'ouverture le long de l'espace tout en continuant à faire levier pour soulever la carte mère.

Soulevez la carte mère lentement. Si vous rencontrez une résistance importante, arrêtez de faire levier et réappliquez l'iOpener.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.