7 단계 번역중
7 단계
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With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:
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SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM layered over the Qualcomm MSM8996 Snapdragon 820
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Samsung KLUBG4G1CE-B0B1 32 GB MLC Universal Flash Storage 2.0
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Avago AFEM-9040 Multiband Multimode Module
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Murata FAJ15 Front End Module
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Qorvo QM78064 high band RF Fusion Module and QM63001A diversity receive module
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Qualcomm WCD9335 Audio Codec
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Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier
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