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11 단계 번역 중

11 단계
We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory! Apple A9 APL1022 SoC + SK Hynix  2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)
  • We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory!

  • Apple A9 APL1022 SoC + SK Hynix 2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH

  • Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)

  • Qualcomm WTR1625L RF Transceiver (as seen in iPhone 6/6 Plus)

  • Qualcomm QFE1100 Envelope Tracking IC (as seen in 6s/6s Plus, and 6/6 Plus)

  • Skyworks SKY77611 Quad-band Power Amplifier Module

  • We'd like to extend a huge thanks to our friends at Chipworks for helping us ID all of these chips! Check out their rad teardown of the iPhone SE for even more silicon goodness.

Nous détachons le fichu connecteur arrière de la carte mère, et admirons ce glorieux champ de silicium !

SoC Apple A9 APL1022 + SK Hynix 2 Go LPDDR4 RAM (comme le signale l’inscription H9KNNNBTUMUMR-NLH)

Modem LTE Qualcomm MDM9625M (comme pour l'iPhone 6/6 Plus)

Émetteur-récepteur Qualcomm WTR1625L RF (comme pour l'iPhone 6/6 Plus)

Circuit intégré de suivi d’enveloppe Qualcomm QFE1100 (comme pour l'iPhone 6s/6s Plus et 6/6Plus)

Module amplificateur de puissance Skyworks SKY77611 Quad-band

Vous voudrions adresser un grand merci à nos amis de Chipworks pour nous avoir aidé à identifier tous ces composants ! Jettez un œil à leur superbe vue éclatée pour encore plus de silicium !

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.