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Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. Here are the front-side chips:
  • Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

  • Here are the front-side chips:

  • HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix H9CKNNNDATMUQRN-UH LPDDR3 RAM

  • Samsung KLMBG2JENB-B041 32 GB eMMC NAND flash memory

  • Texas Instruments BQ25892 fast charging IC

  • HiSilicon Hi6402 audio codec

  • Maxim Integrated MAX98925 audio amplifier

  • Altek AL6610-72M1 AI camera processor (likely)

Qui a collé son chewing-gum ici ? En soulevant la carte mère, nous découvrons plus de pâte thermique que dans n'importe quel autre smartphone.

Et voici les puces sur l'avant de la carte mère :

RAM SKhynix H9CKNNNDATMU 24 Go (3 GB) LPDDR3

Mémoire flash KLMBG2JENB Samsung eMMC 32 Go

Circuit imprimé de chargement rapide Texas Instruments BQ25892

Audio codec HiSilicon Hi6402

[* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
[* black] Here are the front-side chips:
[* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM
[* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=truehttp://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory
[* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM
[* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=truehttp://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory
[* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC
[* green] HiSilicon Hi6402 audio codec
[* light_blue] Maxim Integrated MAX98925 audio amplifier
[* blue] Altek AL6610-72M1 AI camera processor (likely)

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