주요 콘텐츠로 건너뛰기

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 2개에 영향을 미칩니다.

영어
프랑스어

24 단계 번역 중

24 단계
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of seven strips of black tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of seven strips of black tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

Dans les prochaines étapes, vous utiliserez un iOpener pour chauffer la coque arrière de l'iPad afin de ramollir l'adhésif maintenant la carte mère en place.

Lorsque vous chauffez et placez l'iOpener à chacun des emplacements indiqués, laissez-le en place pendant au moins une minute pour qu'il fasse ramollir l'adhésif à travers la coque arrière.

L'adhésif se présente sous la forme de sept bandes de ruban adhésif noir – reportez-vous à cette étape pendant que vous travaillez à chauffer et faire levier pour garder en tête l'emplacement chaque bande.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.